Description This research grade (not for human use) metallic copper 3D-printing ink can be used for printing using a direct extrusion (pneumatic or mechanical) 3D-printer into multi-layered, three-dimensional objects at room temperature. This ink should only be used in a well-ventilated environment. The extruded material rapidly solidifies and allows creation of complex, user-designed forms. Despite being mostly copper, the printed solid material is flexible (may even have limited elastic properties) and it exhibits high conductive even without post-printing curing or sintering (although the 3D-printed copper can be optionally sintered at 700 °C in non-oxidative environment to produce dense metallic 3D-printed parts). The solids loading of the as-dried material is 70 vol.% copper, 30 vol.% PLGA. This conductive copper ink can be utilized to create three-dimensional, highly conductive structures on their own, orco-3D-printed with other 3D-printing inks to create multi-material structures. The ink may also be mixed with other 3D-printing inks to compound them prior to utilization. Due to the mechanical flexibility of the material after drying, complex 2D and 3D forms can be created. This ink may also be utilized in non-3D-aprinting applications such as coating (dip-coating or direct painting), thread fabrication, or casting into molds.Our metallic copper 3D-printing ink is comprised of copper particles (1-10 μm) suspended in a mixture of organic solvents containing a dissolved, high molecular weight elastomeric, biocompatible polyester (polylactic-co-glycolic acid; PLGA). Prior to further use, to remove residual solvents after 3D-printing (or other application such as coating, direct painting etc) the copper composite material should be washed in 70% ethanol and then by water. Preparation instructions Prior to use mix until the ink becomes homogeneous Description This research grade (not for human use) metallic copper 3D-printing ink can be used for printing using a direct extrusion (pneumatic or mechanical) 3D-printer into multi-layered, three-dimensional objects at room temperature. This ink should only be used in a well-ventilated environment. The extruded material rapidly solidifies and allows creation of complex, user-designed forms. Despite being mostly copper, the printed solid material is flexible (may even have limited elastic properties) and it exhibits high conductive even without post-printing curing or sintering (although the 3D-printed copper can be optionally sintered at 700 °C in non-oxidative environment to produce dense metallic 3D-printed parts). The solids loading of the as-dried material is 70 vol.% copper, 30 vol.% PLGA. This conductive copper ink can be utilized to create three-dimensional, highly conductive structures on their own, orco-3D-printed with other 3D-printing inks to create multi-material structures. The ink may also be mixed with other 3D-printing inks to compound them prior to utilization. Due to the mechanical flexibility of the material after drying, complex 2D and 3D forms can be created. This ink may also be utilized in non-3D-aprinting applications such as coating (dip-coating or direct painting), thread fabrication, or casting into molds.Our metallic copper 3D-printing ink is comprised of copper particles (1-10 μm) suspended in a mixture of organic solvents containing a dissolved, high molecular weight elastomeric, biocompatible polyester (polylactic-co-glycolic acid; PLGA). Prior to further use, to remove residual solvents after 3D-printing (or other application such as coating, direct painting etc) the copper composite material should be washed in 70% ethanol and then by water. Preparation instructions Prior to use mix until the ink becomes homogeneous
All
Chemical Reagents
Biomedicine
Organic raw materials
Inorganic chemical industry
intermediate
Agricultural chemicals
Auxiliaries and catalysts
Fragrances and Flavors
Dyes and Pigments
Daily chemical industry
3D printing copper ink
CAS number:unknown molecular formula:
overview
compound introduction
Specs
| Chinese alias | - | ||
| English alias | Copper, Copper ink, Cu, 3D printing copper ink | ||
| CAS number | unknown | molecular formula | |
| molecular weight | - | Exact mass | - |
| PSA | - | logp | - |
numbering system
No numbering system information yet
physicochemical properties
No physical and chemical property information yet
Safety information
No safety information yet
Production methods and uses
No production method and use information yet
Related
upstream information
No upstream information yet
downstream information
No downstream information yet
MSDS
Found 0 shareMSDS




