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Tantalum nitride

Dangerous Goods

CAS number:12033-62-4    molecular formula:TaN

overview

compound introduction

钽的氮化物,以1:1结构为主 antalum nitride is used to create barrier or "glue" layers between copper, or other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on top of silicon wafers during the manufacture of integrated circuits, to create thin film surface mount resistors and has other electronic applications. antalum nitride is used to create barrier or "glue" layers between copper, or other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on top of silicon wafers during the manufacture of integrated circuits, to create thin film surface mount resistors and has other electronic applications.

Specs

Chinese alias一氮化钽
English aliasDTXSID6065183 | Tantalum nitride (TaN) | Tantalum mononitride | Tantalum nitride | azanylidynetantalum | EINECS 234-788-4 | Q415489 | MFCD00049568 | FT-0695184 | tantalum(III) nitride
CAS number12033-62-4molecular formulaTaN
molecular weight194.95 g/molExact mass≥99.5% metals basis
PSA23.800 Ųlogp-

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physicochemical properties

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Safety information

WGK Germany:
3
Personal protective equipment:
Eyeshields, Gloves, type N95 (US), type P1 (EN143) respirator filter

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