应用 半导体材料。薄膜、高密度互连系统和多芯片模块中的介电组分。 其他说明 于 -18°C 下保存以延长保存期。 Application Semi-conductor material. Dielectric component in thin films, high density interconnect systems and multichip modules. Other Notes Store at -18° C for extended shelf life.
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Poly(3,3′,4,4′-biphenyltetracarboxylic dianhydride-co-1,4-phenylenediamine), amic acid solution
CAS number:29319-22-0 molecular formula:(C16H6O6.C6H8N2)x
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| Chinese alias | - | ||
| English alias | - | ||
| CAS number | 29319-22-0 | molecular formula | (C16H6O6.C6H8N2)x |
| molecular weight | - | Exact mass | 电子级 |
| PSA | - | logp | - |
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