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用于氧化还原金属置换反应，以优化铜的化学气相沉积合金化工艺。还用于同时进行铜的蚀刻和钯的沉积，从而应用于超大规模集成设备。 Used in a redox transmetalation reaction to enhance CVD alloying technology for copper. Also used in the simultaneous etching of copper and deposition of palladium for applications in ultra large-scale integrated devices.

Specs ⸢ View details ⸥

Chinese name

六氟乙酰丙酮钯(II)

English name

Palladium(II) hexafluoroacetylacetonate

Chinese alias

二(六氟乙酰丙酮)钯

English alias

MFCD00015709 | 1,1,1,5,5,5-hexafluoro-4-hydroxypent-3-en-2-one;palladium | SY044749

CAS number

64916-48-9

molecular formula

Pd(C5HF6O2)2

molecular weight

520.52 g/mol

Exact mass

≥98%

PSA

Logp

Technical Documents

64916-48-9 | Palladium(II) hexafluoroacetylacetonate.pdf
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